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A full performance, double-sided, flying probe system
At Apex Expo 2011, held at the Mandalay Bay Resort and Convention Center in Las Vegas, Nevada, Seica featured systems which included the Pilot M4 Flying Prober and the Firefly Laser Selective Soldering system. Seica were proud that its original Quick Test software was selected for the Innovative Technology Center, as well as for a poster presentation, which was held at the event.
Pilot M4
The Pilot M4 is a full performance, double-sided, flying probe system. Its high level of flexibility makes it the ideal solution for those with a widevariety of testing needs. The vertical architecture of the Pilot M4 has two flying probes on each side of the UUT, two additional openfix probes, andtwo cameras. The system's configuration allows for true in-circuit testing, giving full access even to boards that do not have all the test points on one side.
The combination of the following test tools and techniques, in a single program, maximizes test coverage and throughput: FNODE signature analysis on the nets of the UUT; PWMON net analysis for power on the boards; Vectorless tests (JSCAN and OPENFIX), to test ICs for opens and Shorts; Analog and digital in-circuit test Op ional Quick Test; Optional functional and visual test capabilities and NETLIST learning procedure used to rebuild layouts and electrical schematics of boards when the relative technical documentation is incomplete or Unavailable; Optional Thermal Scan resources to aid in troubleshooting boards in depot repair.
Quick Test
Quick Test is an innovative software that allows Pilot users to write and execute functional tests quickly. Users are able to correctly program all the system resources, without knowledge of the internal architecture or specific programming language of the ATE. The simple to use graphical interface allows lower skilled operators to perform functional tests. The operator does not have to be concerned about how to send the physical probe pins to the proper x-y locations, as the Flying Prober will send the probes to the right place with a simple understanding of the system channels and nets.
Firefly Soldering System
The Firefly Selective Soldering system is a laser-based technology, developed with complete automation and simplicity of use in mind. The Firefly has been designed to optimize flexibility and automation, including solutions for specific requirements, such as an external pre-heating unit. The Firefly is available in three configurations: top soldering, bottom soldering, along with top and bottom soldering.
The laser in the Firefly system is a clean and versatile technology. The energy through the laser allows for point to point adjustment of the power needed for soldering; the lack of thermal inertia of the laser, combined with real-time temperature readings, enable the dynamic creation of the thermal profile. The ability to apply all of the energy in a single point makes this technology applicable in situations where it is not possible to heat the whole board or where there are problems generated by reduced accessibility. The user is able to change from lead to lead-free solder by simply changing the spool of solder wire. The clean soldering process eliminates the costs and logistics involved with cleaning boards and handling residual waste.
Quick Test is an innovative software that allows Pilot users to write and execute functional tests quickly.
Seica S.p. A in profile
Seica S.p.A, founded in 1986, is a global supplier of automatic test equipment and selective soldering systems, with an installed base of more than 800 systems on four different continents. Seica offers completely automated, laser-based selective soldering solutions, as well as a complete line of test solutions, which include bed of nails and flying probe testers; these have the ability to perform manufacturing defect analysis, in-circuit tests, functional tests and optical tests of loaded boards, second and third level electronic modules and printed circuit boards. Seica S.p.A corporate headquarters is located in Strambino, Italy, with offices in France (Paris), Germany (Munich), USA (New Hampshire and Texas), and China (Suzhou), along with a worldwide distribution network.
For further information view website: www.seica.com Refer to page 141
The first tool to provide an integrated
workflow for DfT and test coverage analysis
from design through to mainstream production
During APEX 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas, ASTER Technologies, the leading supplier in Board-Level Testability and Test Coverage analysis products, announced the first tool to provide an integrated workflow for DfT and test coverage analysis from design through to mainstream production. (Refer to figure: TestWay Express - Integrated DfT workflow from Design to Production).
Design-For-Test is becoming crucial to ensure complex board performances. In the traditional Design flow, DfT is a specific step after the layout phase as addressed by tools such as FabMaster-TestExpert. The CAD file is loaded and a mechanical analysis is performed in order to identify the physical access for In-Circuit or Flying probe test.
With the staggering board density we are now facing, we need to consider the DfT as part of the complete workflow (not just for probe placement), verifying the testability at different stages in order to ensure the highest level of test quality for the minimum test cost.
TestWay Express has been developed to meet this vision for a software tool that will allow users to analyze each stage of the design to production workflow within a single tool.
This is achieved by the following stages: 1) From Schematic, verify that electrical DfT requirements are adhered to in order to maximize test coverage, optimize test probe placement according to test strategy definition, estimate test coverage, estimate cost modeling, production yield and TL9000 - initial return rates. 2) From layout, verify mechanical rules, allocate test probes, estimate test coverage based on the real physical access, and generate test programs including input list and test models for the most popular test platforms.
TestWay Express includes 53 CAD importers supporting schematic netlist, layout, schematic graphics and design or test models. This is a key differentiator as other commercial DfT tools work only from the layout stage. TestWay Express operates from native CAD formats and insures the full interoperability between all stages across the design/manufacturing flow.
In the past, test engineers had to use a variety of software tools to (a) verify that a board had been designed with adequate testability in order to maximize test coverage, and (b) verify that the board layout engineer had placed test points where requested. However, once the test points had been validated it was still necessary to develop the ICT or flying probe test program files, which required another process stage. With TestWay Express, all stages are managed within a single tool through an integrated methodology.
Mr Christophe LOTZ, Managing director of ASTER said: "TestWay Express is a perfect solution to manage DfT as part of the overall design to manufacturing flow. It results in a significant cost saving and contributes to significantly increasing board quality.
Test coverage is estimated using theoretical models for a wide range of test and inspection strategies such as APM, AOI, AXI, BST, FPT, ICT etc, and Functional Test, that can be tuned to reflect the test and measurement capabilities of the target tester.
Once the test/inspection programs have been completed, TestWay Express can read the debugged test program or test report and compare the coverage between the estimated and measured analysis using industry standard metrics, and identify any misalignment.
More than 50 coverage importers are available for a wide range of the test/inspection machines used within the industry such as Acculogic (BS, Scorpion, SPRINT); Aeroflex (4200, 5800); Agilent Technologies (i1000, i3070, 5DX, SJ10, SJ50); ASSET; CHECKSUM; CORELIS; Cyberoptics, DrEschke; Europlacer;GOEPEL (CASCON, OPTICON); JTAG Technologies; Mirtec; MYDATA, OMRON; Orbotech; SAKI; SEICA; SPEA (3030, 4040); TAKAYA (APT8000, APT9000); Teradyne (Z1800, Spectrum, GR228x, TS124); TRI (TR7500, TR8001); VI Technology; VISCOM; XJTAG and YESTech.
For further information about Board-Level Testability and Test Coverage analysis products view website: www.aster-technologies.com
For further information on the first tool to provide an integrated workflow for DfT and test coverage analysis from design through to mainstream production, view website: www.aster-technologies.com