The EVS 1000, a smaller, lighter version
of the popular EVS 3000/6000, with all of the recovery
performance of the standard and lead-free solder units

The EVS 1000 is a smaller, lighter version of the popular EVS 3000/6000, with all of the recovery performance of the standard and lead-free solder units. The smaller size and footprint help to reduce the cost, but still provide a capacity of 10lb/5kg of dross, giving a rapid payback and impressive return on capital employed. The EVS 1000 can quickly convert waste dross into pure solder in minutes not hours, while improving the wave solder machine process. This provides a cleaner wave with less maintenance, less downtime, and a reduction in shorts and bridging as well as the potential to discontinue the use of messy wave oils and/or dross reduction powders. Each model of the EVS Solder recovery system has a Lead and Lead Free version.

The EVS 1000 is aimed at small to medium users who typically have one to three wave solder machines and who must regularly dedross or use nitrogen to reduce drossing. This group currently comprises the majority of users in the industry. By using the EVS, nitrogen can be dramatically reduced or eliminated, resulting in significant cost savings. The EVS 1000 has vastly increased EVS International's coverage of the wave solder marketplace and has revolutionized its total market penetration.

The multiple award winning  EVS 1000 Solder Recovery System from EVS International, the leader in solder recovery.

EVS International's highly successful EVS 1000 has gained global approval with multiple industry awards including "Winner of Best Product" and "Best Environmental Product" at APEX USA 08 and NEPCON CHINA 08 and "Product of the Year" at the most recent Productronica, .Germany

For further information, view website: www.solderrecovery.com

Finetech innovative solutions
for rework and assembly applications

FINEPLACER® matrix
Thanks to its modular system architecture, the FINEPLACER® matrix is an innovative assembly and rework station capable of a wide range of applications to ensure compatibility with future technology developments. The unique market concept of integrated process management (IPM) makes this machine the new reference in micro assembly and professional SMD rework.     

The FINEPLACER® matrix provides a working area of 460 mm x 390 mm or wafers of up to 12", an outstanding placement accuracy of better than 3 µm, closed-loop force control, automated process operation and the ability of system-to-system process transfers, such as from R&D to production. The ergonomic design and intuitive operability, combined with simple servicing and maintenance access, further emphasizes Finetech's guiding principle of designing a machine that is aligned with the needs of the user. In the rework configuration, the FINEPLACER® matrix offers the particularly powerful hot air bottom heating RB30 and sets a new standard in the  rework of large multilayer boards.

FINEPLACER® core
Since its introduction a year ago, the FINEPLACER® core, (Pictured above), has been firmly established in the market. The FINEPLACER® core allows for safe rework of virtually the full bandwidth of typical SMD components with chip sizes ranging from 0.25 mm to 50 mm on board sizes up to 400 mm x 300 mm.

FINEPLACER® core, like all of Finetech's rework systems, is based on superior and proven hot air soldering technology. In order to ensure a very gentle heat transfer according to IPC/JEDEC standards, the intelligent thermal management is comprised of the coordinated control of all process and environment variables as well as the harmonized interaction of top and bottom heating. With respect to components and board size, only the necessary heat is being conveyed. For optimized soldering results, FINEPLACER® core supports the use of nitrogen and other process gases.

Thanks to its compact design, the FINEPLACER® core does not compromise with respect to its functional range either. Quite on the contrary, it efficiently supports all functionalities of a future-proof rework system. The full rework cycle can be integrated into the machine, including de-soldering and soldering, component removal and site cleaning, re-balling (array), paste printing (component or board), paste dipping and fluxing. In particular, small and medium enterprises will find a  versatile and universal solution with an unbeatable range of applications at an attractive price.

Finetech in profile
Finetech is a leading manufacturer of equipment for manual and fully automated assembly and rework of high-precision assembly of electronic / optical components or construction and assembly of complex opto-electro-mechanical systems.  Its core business is the modular FINEPLACER® systems that are characterized by maximum process flexibility in a variety of connection technologies. Different soldering and bonding technologies as well as ultrasonic and thermocompression can be accommodated. Typical applications include the assembly of laser and photodiodes, laser bars, VCSELs or MOEMS and the rework of very small (01005) to very large (45x45 BGA) SMD components. FINEPLACER® systems are used primarily in R & D, prototyping and small series production.

Finetech customers include companies from the sectors of aerospace, automotive, medical / bio / solar technology, optoelectronics, semiconductors, consumer electronics, defense, education and research institutions.

Finetech respond flexibly to specific requirements and offers tailored solutions for demanding customer applications. In addition to a worldwide network of representatives, Finetech is represented in the core markets with direct subsidiaries and provides application support and consultation on site.

Finetech is headquartered in Berlin and has offices located in Arizona, New Hampshire, Shanghai and Kuala Lumpur.

For further information on FINEPLACER® core, view website: http://www.finetech.de 

Innovative SEHO solder nozzles reduce
process related soldering defects in electronic production

SEHO Systems GmbH, expanded range of innovative nozzle geometries for wave soldering machines, establishes a new level of quality in electronic production.

The growing diversity in power electronics poses special new challenges for wave soldering. The current focus is on sufficient heat input with high throughput requirements. SEHO's range of nozzle geometries provides the ideal nozzle concept for every application, from single solder nozzles to a combination of different nozzle geometries. The nozzles significantly reduce typical soldering defects such as insufficient fillings, open solder joints and soldering bridges, leading to remarkable savings in post-soldering.

The changing manufacturing requirements manifest themselves, especially in the configuration of the soldering area. Here, the classic combination of a narrow solder nozzle in the first position and a broader one on the second is being reversed. The result is longer wetting times and improved heat input. Depending on the product, the throughput of the wave soldering system can be accelerated by up to 40 percent, significantly increasing productivity in electronic manufacturing.

All SEHO solder nozzles are suitable for processing lead-free solder alloys. The nozzles can be changed quickly via bayonet couplings in order to minimize retooling and maintenance times.

For further information, view website: www.seho.de  Refer to page 185

The capabilities of today's testers are growing

The capabilities of today's testers are growing. Test times get shorter and the number of parallel tested devices increases. Conventional handlers cannot feed the tester appropriately. The MT2168 closes this gap.

The MT2168 is a unique, industry leading concept which offers a substantial cost of test advantage based on measurable improvements in efficiency, productivity and return on investment.

It features up to 16 easily-adaptable contact sites (prepared for 32 sites), throughput of up to 18,000 uph and offers package style conversion within 10 minutes.  The contact sites are flexible by number and site pitch layout in order to ensure FULL compatibility to ALL existing load boards and the site pitch option allows for easy adaptation in the field. 

The MT2168 is fully configurable to the requirements of engineering sites and high-volume production at IDMs and test houses.  The base handler is scalable from "engineering" set up to high-end in order to optimize for parallelism, test time and throughput.  Upgrade in the field is possible.   

The MT2168 covers the whole range of ambient-hot applications for deThe MT2168 is designed with a reduced number of pick and place transitions. The number of parts in the conversion kits for different packages types is minimized, resulting in easy and fast set-up. Self-teaching processes replace manual adjustments, resulting in a stable and reliable system.

Due to its flexibility and favorable cost structure, the MT2168 is the perfect "one-for-all" platform for integrated device manufacturers, subcontractors and the widest range of applications.

Multitest in profile
Multitest (headquartered in Rosenheim, Germany) is one of the world's leading manufacturers of test equipment for semiconductors. Multitest markets test handlers, contactors, and ATE printed circuit boards under the brands Multitest, ECT Interface Products, and Harbor Electronics. Globally more than 700 employees serve our customers in offices and branches in North America, Singapore, Malaysia, the Philippines, Taiwan, China and Thailand.
vices from 3x3 mm to 70x70 mm with a thickness from 10mm down to 0.3 mm.

For further information, view website: www.multitest.com  Refer to page 160