Whereas the BAT300-Rail device is primarily designed for rail mounting in control cabinets, the BAT300-F version can be installed directly on-site in the field and also outdoors, such as on walls or on posts. Housing dimensions in width by height by depth are 80x100x135 mm (BAT300-Rail) and 261x189x55 mm (BAT 300-F).

The two new IP65 MIMO antennas, which are supplied each with three 90 cm long and preassembled cables with type N connectors as well as R-SMA adaptors, are specifically designed for the IEEE802.11n WLAN transmission standard. The omni-directional BAT-ANT-N-MiMoDB-5N-IP65 antenna can be installed on ceilings, cabinets or mobile equipment. It reaches a gain of 3.5 dBi on the 2.4 GHz and of 5.5 dBi on the 5 GHz band. The BAT-ANT-N-MiMo5-9N-IP65 sector antenna is capable of covering areas of up to 2.2 square kilometers as well as point-to-point connection distances of up to 2 kilometers. With a beam angle of 65 degrees, this 5 GHz antenna provides a gain of 9 dBi.

"The Hirschmann™ BAT 300 access point and the two MIMO antennas deliver an Industrial WLAN system able to support the recently adopted IEEE 802.11n transmission standard," says Product Manager Olaf Schilperoort. "This facilitates data transfer rates like in wired Fast Ethernet networks. Moreover, the hardware meets the demanding requirements for use in even the harshest environments. And the software is capable of far more than just simple Layer 2 functionality."

For further information, view website: www.belden-emea.com    Refer to next page

Belden adds new I/O Modules to its Lumberg
Automation™ LioN-Link Product Portfolio

Belden has added two new bus coupling and six new I/O modules to its range of Lumberg Automation™ LioN-Link I/O systems. These new products enable users - for the first time - to control electrical drives over Profibus, facilitate networking of intelligent sensors and actors, complete simple retrofitting or upgrading of machines deliver safety applications and/or decentralize power supply.

Available with either M12 or M8 connector ports, the new Lumberg Automation™ modules are designed for ease of installation and plug-and-play startup. In addition, they offer comprehensive diagnostics possibilities, meet the requirements of protection class IP67, and exhibit high resistance to shock and jarring. 

The LioN-Link peripheral I/O system can be used for line topologies of up to 100 m in length. The system comprises bus coupling modules for interfacing with higher-level fieldbus systems, including Profibus, CANopen, DeviceNet or Ethernet, and protocol-independent I/O modules. A key benefit is that machine manufacturers only need to implement minor hardware modifications when connecting equipment to end customers' specific communication networks if they use different data transmission protocols.

The 0940 PSL 602 bus coupling module has been specially designed for the control of electrical drives over Profibus-DP V1. Up to nine 0942 UEM 783 motion drive control modules can be connected to its two Link ports, suitable for controlling a maximum of 72 drives.

The motion drive control modules have four outputs that can be configured both for brushless EC and brush-fitted DC as well as other DC motors. Acceleration, speed and deceleration can be controlled in noncyclical mode.

The 0942 UEM 620 I/O Link master module provides point-to-point connections for intelligent sensors and actuators by means of the I/O Link protocol. Four ports can be configured as digital inputs/outputs or for communications mode. The module is wired with three-conductor standard cords that can be up to 20 m in length. The Profibus bus coupling module allows users to connect up to six master modules. In combination with a Profinet bus coupling module from the LioN-Link family, the I/O Link master module can also be used in Ethernet networks.

The 0940 PSL 603 bus coupling module permits the integration of up to thirty 0942 UEM 670 shadow modules in a Profibus network. Serving as inactive secondary components, these modules each provide eight digital I/O connections. They can be activated by means of a hot plug function without compromising the higher-level Profibus communication. In this way, lines can also be retrofitted or upgraded when in operation and without the need for additional hardware.

The 0942 UEM 602 and 0942 UEM 612 I/O modules each feature four digital outputs for an increased output current limiting of 2A per line and a maximum total of 6A. Whereas the 0942 UEM 602 version has standard-type outputs, those of the 0942 UEM 612 version are designed for safety critical applications up to Performance Level D of the new machinery directive. Amongst others, therefore, this module is also suitable for intrinsically safe actuator control or reliable emergency power-off functions.

The 0941 UNC 601/…M LioN-Link power module is used for decentralized power supply. It has four ports, two potential circuits and a 10 m lead with a conductor gauge of 5x1 mm2. This provides for bridging distances of up to 25 m without voltage loss as well as for configuring separate potential groups each with their own fuses.

Beyond ensuring safe data communication, the LioN-Link peripheral I/O fieldbus system also contributes to the efficient operation of machines and plants. Says Product Manager Robert Strehmann: "Regardless of the required wiring in the field, LioN-Link always offers a custom-tailored solution. The system's high level of flexibility pays at the planning stage as well as in any future retrofits or upgrades. Moreover, it also helps to reduce energy consumption."

For further information, view website: www.belden-emea.com   Refer to next page

The management teams from Plus Semi in Swindon(UK) and the former X-FAB facility in Plymouth (UK) take the bold step to re-launch Plessey Semiconductors

Plessey Semiconductors Limited today announced that it has started trading from its semiconductor manufacturing facility in Roborough, Plymouth, UK. Plessey Semiconductors has been created from the acquisition of the share capital of X-FAB UK Limited together with existing key engineering competence within a design and technology centre located in Swindon, UK. The name of the operating business has been subsequently changed to Plessey Semiconductors.

The semiconductor manufacturing facility in Roborough currently produces eight-inch wafers for external customers in a foundry business model on 0.35-micron CMOS process technologies. Plessey Semiconductors is transferring its world-class bipolar process technologies on both silicon and silicon-on-insulator substrates into its Roborough facility. The transfer of these processes is scheduled for completion in 2010. Both the CMOS and the bipolar process technologies will be used to support a set of existing foundry customers. However, Plessey Semiconductors aims to follow in its namesake's footsteps by developing and supporting a range of high performance analog and mixed-signal semiconductor products.

"The historical significance of what we are doing is not lost on the management and employees of our new business," said Michael LeGoff, Managing Director of Plessey Semiconductors Ltd. "A large proportion of our employees started their careers in Plessey working in the various sites around the UK. We see this announcement as a return to our roots. This is a business model that addresses a market that we know very well - designing and manufacturing a set of high technology semiconductor products that competes with any semiconductor company in the world."

Paul James, Commercial Director of Plessey Semiconductors Ltd. said: "We are very excited about the re-launch of the Plessey Semiconductors' brand and our new business strategy. Our positioning addresses the critical and immediate requirements we have identified in the market for our high performance analog technology and products. We have been receiving very positive responses from the market about our plans to support both our existing foundry customers and to engage new customers with exciting new product releases. The first of these product families is on schedule for release later in 2010."

The UK's South West RDA (Regional Development Agency) will part-fund the project by providing nearly one million pounds Sterling under the Grant for Business Investment scheme when the deal is completed. Paul Wilson, Business Investment Adviser for the South West RDA said: "We are delighted to support a solution that provides continuity of well-paid high tech manufacturing jobs in the region. The South West RDA is extremely pleased to be able to contribute to what should be an exciting new venture in the region."

Plus Semi and X-FAB issued a joint news release that announced the original sale agreement on 1st December 2009. The acquisition of X-FAB UK Limited was completed on 6th January 2010, effective 31st December 2009.

Plessey Semiconductors Limited in profile
Plessey Semiconductors are the world experts in the development and manufacture of CMOS and bipolar analog/mixed-signal processes and products for the electronics, telecommunications, defence, medical, aerospace and automotive markets. Plessey Semiconductors offers its customers CMOS, bipolar, complementary bipolar and BiCMOS process technologies on both silicon and silicon-on-insulator substrates. The Plessey Semiconductors products have been specifically designed for RF and sensing applications. The suite of state-of-the-art high precision, high voltage products are available in high temperature and radiation tolerant options.

All trademarks are recognised and are the property of their respective companies.

For further information contact, Dr. Paul James, Commercial Director, Plessey Semiconductors Ltd, e-mail: paul.james@plesseysemi.com

Fujitsu renames semiconductor subsidiaries
to more accurately reflect core business

Fujitsu Microelectronics Europe GmbH becomes Fujitsu Semiconductor Europe GmbH on July 1, 2010, and at the same time celebrates its 30th anniversary in Europe. Fujitsu Limited also celebrates its 75th anniversary.

Fujitsu Semiconductor Limited today announced that it will rename nine of its group companies, of which Fujitsu Microelectronics Europe is one, effective July 1, 2010. Originally established as Fujitsu Microelectronics Ltd in 2008, following the reorganisation of Fujitsu's semiconductor activities, the name was changed to Fujitsu Semiconductor Ltd on April 1st this year. This change more accurately reflects its core business. In association with this corporate name change, nine of Fujitsu Semiconductor's group companies will also change their names.

Brendan Mc Kearney, Managing Director of Fujitsu Semiconductor Europe (FSEU) commented, "Our name change reflects more accurately the focus of our activities, namely semiconductor products, solutions and related services. We expect that this will present a clearer image to our existing and potential customers and reflect the global role of Fujitsu's semiconductor activities."

Headquartered in Langen, near Frankfurt, Germany, Fujitsu Semiconductor Europe continues to strengthen its presence and stability, employing more than 300 people throughout the EMEA region, with sales & marketing offices and design & development centres based in Germany, UK, Austria, France, Italy and Hungary. For further information, view website: http://emea.fujitsu.com/microelectronics   Refer to page 121