K F Rowe's Peter Rowe, added: "Borri's ECO-UPS equipment was recommended to me by another contractor. Their pricing for the project was very competitive; the service was brilliant and they helped complete the job in just three days during August."

In addition to first-class service levels and affordability, Borri's ECO-UPS range has Smart On-Line technology (SOL), which cleverly monitors the quality of power supplied and chooses the most efficient operating mode, based on the environmental conditions at the time, to achieve efficiency levels of up to 98 per cent.
Unlike other UPS systems, the B9000FXS's SOL technology provides total operating control as the system will always revert to online double conversion (VFI) mode as default, until an operator defines the characteristics to run in high-efficiency direct line mode.

This innovative FXS range of UPS systems retain the same precision engineering, functionality and multifunctional characteristics of its predecessors, such as IGBT input (insulated gate bipolar transistors), high energy absorbing filters and multi-level protection, but provides even greater efficiency, which can help top football clubs hit tough power usage and carbon reduction targets.

It also comprises a sophisticated load based shutdown (LBS) function, designed to maximise the efficiency of parallel redundant installations. Sports stadia that utilise the LBS function will significantly increase the efficiency of the UPS solution and therefore reduce power usage and lower energy bills.

Borri's cost-effective range of ECO-UPS solutions ensure a continuous source of highly-efficient power in sports stadia, which is vital for the safety of spectators, without compromising on the levels of electrical protection.

The flexibility and superior quality of performance from Borri's extensive UPS range makes them suitable for a wide range of applications. For more information on the company's products or services or to arrange a free site survey please visit www.borri.co.uk or call 0800 136 993

Borri Ltd in profile
Borri Ltd is an independent business which works closely with its sister brand Borri S.p.A based in Italy manufacturing and supplying high-efficiency Uninterruptible Power Supply (UPS) systems.

With extensive experience of UPS systems, the UK company began trading in 1994, supplying UPS systems from 1kVA to 1MVA from its Sheffield headquarters.
The company offers full turnkey UPS solutions, electrical infrastructures, delivery, positioning and SLA driven maintenance contracts to over 2,000 customer sites in a variety of sectors, from academia to manufacturing.

Borri S.p.A has been manufacturing in Italy for over 75 years, has a turnover in excess of 80million euros with offices and distributors across the globe, providing customers with an unparalleled range of products and services.

For further information, view website: www.borri.co.uk

Fairchild Semiconductor's MicroFET™ Thin Package
targets battery-charging and power-multiplexing applications

Fairchild Semiconductor's (NYSE: FCS) MicroFET thin package helps designers avoid compromising their designs by providing them with an industry-leading low profile package. Working with design engineers and procurement managers, Fairchild developed an integrated P-Channel PowerTrench® MOSFET and Schottky diode, as a single-package solution to meet critical efficiency and thermal needs in battery charging and power-multiplexing applications. (Refer to picture on the right).

The FDFMA2P859T provides excellent power dissipation and conduction loss characteristics, compared to conventional MOSFETs, all while providing a 30 percent height reduction over the industry-standard 0.8mm MicroFET package. With a 0.55mm package height, this device is ideal for low profile designs, such as those common in the latest portable and wearable cell phones, media players and medical devices.

The customers design requirements for the FDFMA2P859T was for the device to provide exceptional thermal performance for its physical size, and to ensure a very low reverse leakage current (lr) of 1µA at Vr=10V, for the Schottky diode. These attributes are important in improving performance and efficiency in linear mode battery charging and power-multiplexing applications.

The FDFMA2P859T is part of Fairchild's extensive MOSFET portfolio designed to meet the efficiency, space and thermal needs of today's and future design challenges.

Fairchild Semiconductor in profile
Fairchild Semiconductor (NYSE: FCS) is a global leader delivering energy-efficient power analog and power discrete solutions. Fairchild is The Power Franchise®, providing leading-edge silicon and packaging technologies, manufacturing strength and system expertise for consumer, communications, industrial, portable, computing and automotive systems. An application-driven, solution-based semiconductor supplier, Fairchild provides online design tools and design centers worldwide as part of its comprehensive Global Power Resource^SM.

For further information on other products, design tools and sales contacts, view website: http://www.fairchildsemi.com

For product and company videos, listen to podcasts and comment , view website blog: http://www.fairchildsemi.com/engineeringconnections

Metris XT V 130 X-ray inspection
system for electronics quality assurance

Metris' compact, yet versatile XT V 130 x-Ray inspection system efficiently traces failures inside complex electronic devices and multilayer circuit boards. To maintain highest quality standards in an environment of continuous miniaturisation, electronics manufacturers prefer deploying intuitive, reliable and efficient X-ray imaging capability in house. The XT V 130 is a compact and affordable X-ray system for automated QA on serial-produced electronic samples.

Hidden electronic defects arisen during production or assembly generally result in system failure, fabrication, delay and additional cost. These defects can be detected efficiently early on in the process by taking An in-depth look at the inside of electronic specimens. Designed for high-throughput electronics X-ray inspection, the XT V 310 is a real QA workhorse that allows operators to provide instant pass/fail status. Automated inspection functions and (optional) automatic board identification ensure high inspection throughput rates. Inspection reports compliant with MRP systems facilitate tight integration into customers' manufacturing processes. Today . Any OEM and sub-system supplier of consumer, automotive, aerospace, medical and electronics can take advantage of X-ray inspection technology to get the job done!

Metris' new compact, yet versatile XT V 130 x-Ray inspection system.

Qualitative and robust X-ray imaging
The system comes withy a 30-130 kV open micro-focus X-ray source, a 4-axis programmable manipulator and a 16-bit imaging system based on a 4 inch image intensifier. A focal spot size down to 3 micron, 320x geometric magnification and tilt up to 60º offer excellent image quality and sufficient flexibility. A rotate stage and CT capability are available as an option. A hinged door provides easy access to the inspection area, which fits samples up to 40x35cm. Using qualitative real-time X-ray capabilities, operators intuitively navigate bthrough the layers of a PCB or inside electronic devices by changing position, angle and zoom as desired using the joystick. The XT V 130 system is ideally suited to quickly trace inconsistencies, connectivity issues, incomplete through-layer vias and other failures.

Intuitive and interactive image processing
The intuitive operation of the compact XT V 130 system is controlled by Inspect-X, the powerfull proprietory software used on all Metris XT systems. Inspect-X is known for its powerfull X-ray image processing and analysis as well as the broad set of automation capabilities that is included. Developed to streamline the inspection process with ultrafast X-ray acquisition, the XT V 130 runs first-article inspection in minutes, instead of hours or days.

Providing real value for money
Besides easy opersation, the Metris XT V 130 system offers low cost of ownership. The o;pen X-ray tube installed in the system allows for qick replacement of low-cost filaments. All serviceable are installed on a drawer that can be opened from the front, making the system very easy to service. Thanks to its footprint that is limited to 1m², a built-in generator and weight below 1150kg, the Metris XT V 130 system easily fits any electronics production area without requiring high-voltage powern or special floor conditions. The systems' protective enclosure puts safety first, avoiding the use of dedicated badges or protective clothing.

A complete range of electronic X-ray systems
In Metris' range of electronic X-ray systems, which originates from the renowned X-ray system manufacturer X-Tek, the XT V 130 is a QA workhorse machine with an optimum performance-price ratio. It ideally complements the top line XT V 160 system, previously named X-Tek Revolution, a powerful R&D and production engineering system featuring a superb nanotech 160kV X-ray source. The possibility to configure a flat panel imager enables the system to aquire images of the highest resolution. In addition, the XT V 160 offers CT capability, a market-leading 75º tilt angle and a standar4d rotate stage with true concentric imaging to readily reveal and resolve weak points in the PCB manufacturing process. Recently, the design of the top-line XT V 160 system has been further benhanced based on customer feedback, To obtain faster access to the inspevtion area and better viewing of the sample, the sliding window is replaced by a standard door and window combination. This modification also allows larger samples to be inserted into the system and provides easier access to the gun for filament changes. To simplify system operation, all controls have been centralised into a single easy-to-use panel. Furthermore, the sample manipulator has been strengthened further to make concentric movement of the sample even more accurate and stable.

Overall, Metris has a worldwide install base of approximately 1,500 X-ray and CT systems.

For further information, e-mail: Renaat.vancauter@nikonmetrology.com or view website: www.nikonmetrology.com   

Submersible Molex MX150 Headers
afford superior sealing and electrical performance

Molex Incorporated recently unveiled high performance MX150™ single- and dual-row headers for use in high-temperature automotive and commercial vehicle applications.  Complementing widely used and industry-recognised MX150 receptacle connectors (series 33471 and 33472), the MX150 sealing interface has been optimized to meet IP6K7 and IP6K9K sealing requirements.

"Designed for automotive and commercial vehicles, recreational vehicles, construction equipment, and marine applications, MX150 headers expand on the Molex portfolio of automotive and industrial solutions," states Corey Schroeder, Industry Marketing Manager, Molex.  "In wire-to-board configurations, the preassembled, submersible MX150 system simplifies device tooling by incorporating USCAR-specified interface geometry directly into the sealed headers."

MX150 Connector Key Features:

1) Rugged, environmentally sealed connector system supports both low-level signal and power applications up to 22.0A.
2) PCB board alignment and retention features simplify header placement and retention.
3) Sealing geometry incorporates spray shield to meet IP6K7 and IP6K9K requirements.
4) A true sealed connector system, the MX150 header system has been tested and confirmed to perform under submersed conditions in various fluids.
5) High-performance MX150 connector system in reduced package size - ideal for SAE-style wire in challenging applications.

The economical MX150 connector system features all-in-one plug and receptacle housings with pre-assembled, wire and interfacial connector seals.  The solder-tail and compliant-pin electrical interfaces provide module design flexibility and lower applied costs by eliminating the need to purchase, handle and crimp individual wire seals.  Integral terminal position assurance (TPA) and optional connector position assurance (CPA) components allow simple terminal insertion and secure seating to prevent accidental disengagement during high vibration and severe shock applications.  Plastic seal plugs facilitate sealing of unused circuits.  And, easy terminal extraction and insertion enable quick, low-cost field repairs.

Integral, two-way matte and interfacial Molex MX150 header seals conform to IEC IP67 and SAE USCAR-2, Rev 4 standards and are rated for use in on-engine, high vibration, under-hood and under-chassis environments at class 3 (-40 to +125°C) operating conditions.  Molex manufacturing facilities are ISO9000 and ISO14000 certified.  For further information, view website: www.molex.com or  follow on Twitter: www.twitter.com/molexconnectors   Refer to page 113