Ball grid array package reduces memory footprint by more than 75%

Ramtron International Corporation (Nasdaq: RMTR), a leading developer and supplier of nonvolatile ferroelectric random access memory (F-RAM) and integrated semiconductor products, offer its 4-megabit (Mb) F-RAM memory in a streamlined FBGA package. The FM22LD16 is a 4Mb, 3-volt, parallel non-volatile RAM in a 48-pin ball grid array (FBGA) package that features fast access, virtually unlimited read/write cycles and low power consumption. Pin-compatible with asynchronous static RAM (SRAM), the FM22LD16 targets industrial control systems such as robotics, network and data storage applications, multi-function printers, auto navigation systems and a host of other SRAM-based system designs. Ramtron's 4Mb parallel F-RAM is also available in a 44-pin thin small outline plastic (TSOP) package.

"The FM22LD16 allows system designers to fit four times the F-RAM density into the same footprint," explains Ramtron Marketing Manager, Duncan Bennett. "Manufacturers of RAID controllers and industrial PCs with limited board area will find the new 4Mb FBGA package option very appealing. With no need for a battery and a new smaller memory footprint, the 4Mb F-RAM is the most space efficient nonvolatile RAM on the market."

Product Features
The FM22LD16 is organized as a 256K x 16 nonvolatile memory, accessed with an industry standard parallel interface.  Access time is 55ns and cycle110ns. The device reads and writes at bus speed for NoDelay™ writes with endurance of at least 1E14 (100-trillion) writes and 10-year data retention.

This 4Mb FRAM is a drop-in replacement for standard asynchronous SRAMs, but far superior as it does not require a battery for data backup and is inherently more reliable due to its monolithic form. The FM22LD16 is a true surface-mount solution, requiring no rework steps for battery attachment and, unlike battery-backed SRAM, is highly resistant to moisture, shock and vibration.

With a convenient interface to current high-performance microprocessors, the FM22LD16 features a high-speed page mode that enables 4-byte burst read/write operations at up to 40MHz, a bus speed significantly higher than other nonvolatile memory. The device boasts a lower operating current than similar density nonvolatile memories, drawing 8 milliamps for reads/writes and a standby current of 90 microamps.  It operates from 2.7 to 3.6 volts over the industrial temperature range (- 40°C à +85°C).

Two new devices added to the family of high-speed F-RAM from Ramtron

Ramtron International Corporation, are also offering two more devices in a family of new parallel and serial F-RAM products that offer higher-speed read/write performance, lower voltage operation, and optional device features. The newest devices in Ramtron's V-Family of F-RAM products are the 512-Kilobit (Kb) FM24V05, and the 1-Megabit (Mb) FM24V10. The new products are 2.0 to 3.6-volt, serial nonvolatile RAMs in 8-pin SOIC packages that use the two-wire (I²C) protocol.The FM24V05 and FM24V10 feature fast access, NoDelay™ writes, virtually unlimited read/write cycles, and low power consumption. The devices are drop-in replacement for 512Kb and 1Mb serial Flash and serial EEPROM memories in industrial controls, metering, medical, military, gaming, and computing applications, among others.

"We now offer 512-Kilobit and 1-Megabit device options in our V-Family lineup with the I²C interface that operate at a lower and wider voltage range for greater power efficiency," remarks Mike Peters, Ramtron marketing manager. "The FM24V05 and FM24V10 provide a significant upgrade over EEPROM devices due to their lower power consumption, orders of magnitude more endurance, and improved read and write performance."

The FM24V05 is ideal for nonvolatile memory applications that require frequent or rapid writes, such as data collection, where the number of write cycles may be critical.  Demanding industrial controls can benefit from the FM24V05 where the long write time of EEPROM can cause data loss.  All serial F-RAM V-Family products can be equipped with optional device features including unique serial numbering and a customizable system reset.

Other devices within the Ramtron V-Family of F-RAM products include the recently announced FM25V05 (512Kb) and FM25V10 (1Mb) serial SPI products, and the FM28V100 (1Mb) parallel nonvolatile RAM.

About the FM24V05 and FM24V10
The FM24V05 and FM24V10 are serial ferroelectric random access memories organized as 64K x 8-bit and 128K x 8-bit memory arrays, respectively, and are accessed using an industry standard two-wire (I²C) communication interface. Unlike an EEPROM, F-RAM serial memories do not need to be polled for a ready condition since reads and writes occur at the full bus speed of the serial protocol. The FM24V05 and FM24V10 support up to 3.4 MHz bus speed, which represents a threefold increase in clock speed as compared to previous I²C Serial F-RAM devices. 

The FM24V05 and FM24V10 provide data retention for over 10 years while eliminating the complexities, overhead, and system level reliability problems caused by EEPROM and other nonvolatile memories.

The FM24V05 and FM24V10 have a read-only device ID and can be ordered with a unique serial number and/or system reset option. The device ID provides information about the manufacturer, product density, and product revision of the device. The unique serial number allows the host to have an ID that is different from any other host in the world. The system reset option eliminates the need for an external reset component in the system.

The FM24V05 and FM24V10 operate over the industrial temperature range of -40°C to +85°C in a low voltage, low power operation of 2.0V-3.6V with an active current of less than 150 microamps (typical at 100KHz), 90 microamps in standby, and 5 microamps during sleep mode.

Ramtron in profile
Ramtron International Corporation, headquartered in Colorado Springs, Colorado, is a fabless semiconductor company that designs, develops and markets specialised semiconductor memory and integrated semiconductor solutions used in a wide range of product applications and markets worldwide.

For further information, e-mail: chris.wray@ramtron.com or view website: www.ramtron.com     

New Aeroflex 7100 Digital Radio Test Set delivers
a comprehensive 3G LTE mobile device test capability

Aeroflex now offer several new product features for its PXI Modular Instrument 3000 Series that will provide users with a greater degree of flexibility than ever before. To meet customers' current and future RF testing needs, Aeroflex is advancing its PXI 3000 product line with the addition of a new embedded PXI system controller, enhancements to the 3030 Series GSM/EDGE measurement suite and two new arbitrary waveform generation (AWG) memory options for 302xC models. The 3000 Series also now includes SelfTest capabilities and general enhanced functionality with the latest driver updates.

"We continually evolve our comprehensive modular RF test platform with performance and flexibility improvements in conjunction with the advancing technologies our customers encounter," said Tim Carey, PXI product manager, Aeroflex. "With the addition of these enhancements, our PXI platform is not only keeping pace with our customers' needs, but staying one step ahead of them."

The new 3001B PXI slot 1 system controller is replacing the 3001A. The 3001B offers up to ten percent faster measurement speed over the 3001A and incorporates an Intel® Pentium™ M 760 2.0 GHz processor with 1.5GByte memory and 80GByte HDD. This controller also includes a built-in IEEE488.2 GPIB controller, DVI-1 video, a high-definition audio I/O and will be supplied with a Windows® XP™ operating system. To accommodate the new 3001B, Aeroflex is introducing a modified 3000B 8-slot PXI Chassis with touch screen LCD panel display to replace model 3000A.

The enhancements to the GSM/EDGE PXI measurement suite (3030 Series Option 100) complete Aeroflex's range of PXI measurement suites supporting 3GPP cellular wireless standards. The latest measurement suites add a high-level programming interface and a graphical user interface plug-in for use with Aeroflex's PXIStudio application software. The GSM/EDGE measurement suite simplifies programming and integration of PXI into automated test applications for GSM/EDGE handsets/devices.

Aeroflex are also offering two new AWG memory extensions for the 302xC RF signal generator series including Option 03 (1GByte) and Option 04 (2GBytes). Both options are low-cost, deep-memory AWG solutions for applications requiring larger playback times or multiple waveform segments. With 3020 option 01 also fitted, these AWG signals are also available as differential baseband I & Q outputs as well as modulated RF outputs.

Also available for PXI is a new SelfTest software utility that performs system-level verification of all Aeroflex 3000 Series module variants when configured for transceiver testing. The software provides test log reports and first-step diagnostics if a problem is detected, providing complete confidence in the operation and performance of the PXI system and minimizing downtime when trying to decide which component to swap out.  SelfTest is a free download utility from the Aeroflex website.

The latest driver software for the Aeroflex 3000 Series, version 6.3.0, adds new functionality including acquisition triggering capabilities that improves immunity from false triggering from extraneous signals, flexible AWG trigger functions, extended FM modulation deviation range and higher speed signal generator list mode switching. Together these capabilities make manufacturing test applications more robust and easier to integrate.

The 3000B 8-slot PXI Chassis, 3001B PXI slot 1 embedded system controller and 3020 AWG memory extension options 03 and 04 are now available. The PXI 6.3.0 driver software and SelfTest application supporting the Aeroflex 3000 Series of PXI-based modular RF instruments will be made available to download free of charge from the Aeroflex web site.

The new Aeroflex 7100 Digital Radio Test Set delivers a comprehensive 3G LTE mobile device test capability, including the following benefits: 1) Fully integrated RF interface, baseband and IP protocol stack. 2) Uniquely offers RF parametric and protocol test features. 3) Intuitive touch-screen control facilitates easy access to complex testing scenarios

Aeroflex's 7100 Digital Radio Test Set designed to enable chip-set designers, software developers and handset manufacturers accelerate the pace of development projects to meet the requirements of the new 3GPP Rel-8 E-UTRAN standard better known as 3G LTE. The Aeroflex 7100 delivers the most comprehensive testing capability for 3G LTE mobile devices available in a single bench-top instrument.

Utilising intuitive touch screen technology to provide easy access to comprehensive test functionality, the Aeroflex 7100 incorporates a fully integrated RF interface, baseband and protocol stack. The Aeroflex 7100 simulates the network from the physical layer to the core network IP infrastructure uniquely offering both parametric analysis and protocol logging and diagnostics. End-to-end IP connectivity allows the data throughput performance and latency to be assessed. With a base frequency range of up to 6GHz, the Aeroflex 7100 is designed to cope with both current and potential future spectrum allocations.

Optional features of the Aeroflex 7100 include 2x2 MIMO and built in 'fading' simulation, allowing device throughput to be assessed in real-world conditions. An optional second RF carrier is also available for handover test scenarios, a major challenge for mobile device designers. For further information, e-mail: jim.debroeck@aeroflex.com or view website: www.aeroflex.com    Refer to next page